Tool Type:Automated Semiconductor Bonding
Bonding Technology:Intricate Micro-Bonding
Maximum Workpiece Size:Up to 6 inches
Process Speed:Up to 1200 parts per hour
Bonding Force Range:20 to 200gf
Temperature Control:±0.1°C
Vacuum Level:99.99%
Power Consumption:1500W
Dimensions:420mm x 450mm x 700mm
Weight:250kg
The K&S AS-261-0-02 is engineered with cutting-edge technology to deliver unparalleled precision in semiconductor assembly processes. Its compact design allows for efficient use on the factory floor, while its robust construction ensures reliability over long periods of operation.
Featuring a sophisticated bonding mechanism, this tool is capable of handling intricate micro-bonding tasks with ease, making it an indispensable asset in semiconductor fabrication. It supports a wide range of workpiece sizes, from small components to larger assemblies, ensuring flexibility across various applications.
With a process speed of up to 1200 parts per hour, the K&S AS-261-0-02 maximizes productivity without compromising on quality. Its adjustable bonding force range of 20 to 200gf ensures precise control over the assembly process, leading to superior connection strength and durability.
Temperature control is critical in semiconductor bonding, and the K&S AS-261-0-02 excels in this area, maintaining a tight tolerance of ±0.1°C throughout the process. Coupled with an ultra-high vacuum level of 99.99%, it achieves exceptional purity in the bonding environment, minimizing contamination risks.
Power efficiency is another highlight of this tool, consuming just 1500W while delivering high performance. This not only saves energy but also reduces operational costs significantly. Moreover, the ergonomic design ensures easy maintenance and hassle-free operation, contributing to a smoother workflow in the manufacturing environment.
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