Model Type:Compact Control Module
Operating System:GE Intelligent Platforms Software Suite
Processing Speed:Up to 1 MHz
Memory Capacity:128 KB RAM, 32 KB Flash ROM
Power Consumption:≤ 5 W
Operating Temperature:-10°C to +55°C
Storage Temperature:-40°C to +70°C
Reliability Rating:MTBF > 200,000 hours
Communication Protocols:Modbus, Ethernet/IP, DeviceNet
The GE Fanuc IC693MDL230 PAC Systems RX3i boasts a compact design, ensuring efficient use of space on your control panel. Its high-performance processor delivers swift operation, even under demanding conditions.
Equipped with a robust set of communication interfaces, this module seamlessly integrates with various devices and systems, enhancing connectivity and operational efficiency across your factory floor.
Designed with reliability at its core, the IC693MDL230 withstands harsh industrial environments, thanks to its wide temperature range and durable construction.
Offering ample memory resources, it can handle complex control algorithms and data processing tasks, making it ideal for applications requiring high precision and accuracy.
User-friendly diagnostics and maintenance features simplify troubleshooting and system upkeep, reducing downtime and minimizing maintenance costs.
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