Material:High-grade stainless steel
Max Vacuum Compatibility:Ultra-high vacuum
Temperature Range:-20°C to +150°C
Electrostatic Force Adjustment:Variable through electronic control
Operating Pressure:0.1 Torr
Chucking Capacity:50 mm x 50 mm
Vacuum Pump Compatibility:Industry-standard compatible
The LAM ELECTROSTATIC CHUCK 839-800327-315 is engineered to provide unparalleled stability during plasma etching and deposition processes, essential for achieving superior microelectronics fabrication quality.
Crafted from high-grade stainless steel, this chuck ensures durability and resistance to corrosion, making it suitable for long-term use in the most demanding environments.
With adjustable electrostatic force, our chuck offers precise control over wafer holding, minimizing slippage and enhancing process yield.
Adaptable to various vacuum systems, it seamlessly integrates with existing semiconductor manufacturing equipment, streamlining your production workflow and reducing setup times.
Designed for optimal performance across a wide temperature range, it maintains consistent chucking force even under extreme conditions, ensuring reliable operation throughout the manufacturing process.
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